LED specialist Nichia will exhibit its latest automotive lighting solutions at SIA Vision 2024 held from October 16-17 in Paris, France, with a focus on lighting for adverse weather conditions.
ClassOne Technology has announced that Georgia Institute of Technology (Georgia Tech) has selected a Solstice S8 single-wafer processing system for its advanced packaging R&D program.
Japanese firms Denso and Rohm have announced plans to set up a semiconductor partnership focused on automotive applications. As part of this, Denso will acquire a portion of Rohm's shares.
The 8.5 µm pixel pitch technology is claimed to be the smallest infrared sensor candidate for future Automatic Emergency Braking (AEB) and Advanced Driver Assistance Systems (ADAS).