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EDN
11 小时
Wide-creepage switcher improves vehicle safety
A wide-creepage package option for Power Integrations’ InnoSwitch 3-AQ IC enhances safety and reliability in automotive ...
EDN
11 小时
GPU IP powers scalable AI and cloud gaming
Vitality is VeriSilicon’s latest GPU IP architecture targeting AI PCs, cloud gaming, and both discrete and integrated ...
EDN
1 天
Metamaterial’s mechanical maximization enhances vibration-energy harvesting
The number of ways to harvest energy that would otherwise go unused and wasted is extraordinary. To cite a few of the many ...
EDN
11 小时
R&S boosts GMSL testing for automotive systems
Rohde & Schwarz expands testing for automotive systems that employ Analog Devices’ Gigabit Multimedia Serial Link (GMSL) ...
EDN
1 天
Gen3 UCIe IP elevates chiplet link speeds
Alphawave Semi’s Gen3 UCIe Die-to-Die (D2D) IP subsystem enables chiplet interconnect rates up to 64 Gbps. Building on the ...
EDN
1 天
UWB radar SoC enables 3D beamforming
Hydrogen, an ultra-wideband (UWB) radar SoC from Aria Sensing, delivers 3D MIMO beamforming with programmable pulse ...
EDN
1 天
Save, recall, and script oscilloscope settings
Reading and editing Visual Basic scripts or Standard Commands for Programmable Instruments (SCPI) to recall instrument ...
EDN
2 天
Perceiving the insides of a wireless camera flash receiver
After previously tearing down a transmitter, our intrepid engineer now tackles the other end of the wireless connection.
EDN
7 天
Innovative manufacturing processes herald a new era for flexible electronics
Electronics engineers are evaluating novel techniques for transfer printing, wiring, and additive manufacturing.
EDN
9 天
2025: A technology forecast for the year ahead
Elections, geopolitical tensions and AI…oh my! Read on for our intrepid engineer’s latest set of predictions (or, at minimum, ...
EDN
7 天
Touch controller eases user interface development
Microchip’s MTCH2120 turnkey touch controller offers 12 capacitive touch sensors configured via an I2C interface.
EDN
10 天
AI designs and the advent of XPUs
An XPU comprises four layers: compute, memory, network I/O, and reliable packaging technology. Industry watchers call XPU the ...
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