Several critical processes address wafer flatness, wafer edge defects and what's needed to enable bonded wafer stacks.

Keeping up with attackers is proving to be a major challenge with no easy answers; trained security experts are few and far between.

PCIe 6.1 flow control; formal basics; cloud EDA boosts time to market; testing PCB interconnects with boundary scan; ...

“While experiments have shown devices can retain information for over 10 years, the models used in the community show that ...

A new technical paper titled “Impact of Strain on Sub-3 nm Gate-all-Around CMOS Logic Circuit Performance Using a Neural ...

New architectures, opportunities, and challenges as chipmakers move from monolithic architectures to chiplets.

A new technical paper titled “Towards Efficient Neuro-Symbolic AI: From Workload Characterization to Hardware Architecture” ...

PIM memory management; carbon nanotube FETs; high-degree polynomial gradients in memory; STT-MRAM; neuro-symbolic AI HW architecture; state of the ...

A newly drafted IEEE standard will bring more consistency to defect metrics in analog/mixed (AMS) designs, a long-overdue step that has become too difficult to ignore in the costly heterogeneous ...

Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...

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In the last decade, the use of ML/AI exploded in the areas of speech recognition, facial recognition, smart phone features, ...