Keeping up with attackers is proving to be a major challenge with no easy answers; trained security experts are few and far between.

Several critical processes address wafer flatness, wafer edge defects and what's needed to enable bonded wafer stacks.

PCIe 6.1 flow control; formal basics; cloud EDA boosts time to market; testing PCB interconnects with boundary scan; ...

“While experiments have shown devices can retain information for over 10 years, the models used in the community show that ...

New architectures, opportunities, and challenges as chipmakers move from monolithic architectures to chiplets.

PIM memory management; carbon nanotube FETs; high-degree polynomial gradients in memory; STT-MRAM; neuro-symbolic AI HW architecture; state of the ...

A new technical paper titled “Impact of Strain on Sub-3 nm Gate-all-Around CMOS Logic Circuit Performance Using a Neural ...

A new technical paper titled “Towards Efficient Neuro-Symbolic AI: From Workload Characterization to Hardware Architecture” ...

A newly drafted IEEE standard will bring more consistency to defect metrics in analog/mixed (AMS) designs, a long-overdue step that has become too difficult to ignore in the costly heterogeneous ...

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Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...

In the last decade, the use of ML/AI exploded in the areas of speech recognition, facial recognition, smart phone features, ...