This application note provides design and manufacturing guidance in the use of the lead frame chip scale package (LFCSP). The LFCSP is compliant with JEDEC MO220 and MO229 outlines. The LFCSP is a ...
Many industries are calling for electronics that can operate reliably in harsh environments, including extremely high temperatures. Traditionally, engineers had to rely on active or passive cooling ...
Today’s designs require an increasing number of power rails and supply solutions in electronics systems, with loads ranging from a few mA for standby supplies to over 100A for ASIC voltage regulators.
For a human, experiencing a fall unobserved can be doubly dangerous. The obvious possibility of initial injury may be further aggravated by the possible consequences if treatment is not obtained ...