“While experiments have shown devices can retain information for over 10 years, the models used in the community show that ...

New architectures, opportunities, and challenges as chipmakers move from monolithic architectures to chiplets.

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Several critical processes address wafer flatness, wafer edge defects and what's needed to enable bonded wafer stacks.

A new technical paper titled “Towards Efficient Neuro-Symbolic AI: From Workload Characterization to Hardware Architecture” ...

A new technical paper titled “Impact of Strain on Sub-3 nm Gate-all-Around CMOS Logic Circuit Performance Using a Neural ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

A demonstration of process modeling, virtual wafer fabrication, and virtual metrology in process development of advanced logic and memory.

Chiplet-based products must accommodate small differences in die size and bump pitch, placing new demands on manufacturing ...

In the last decade, the use of ML/AI exploded in the areas of speech recognition, facial recognition, smart phone features, ...

Development methodologies combine old and new techniques, but getting any new material into high-volume manufacturing is a ...

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What ...